The company’s new chip technology will lower antenna size by 50%, maximizing interior space
Samsung Electronics has unveiled three new 5G chipsets for next-generation RAN (radio access network) devices, as it continues to invest in the 5G infrastructure space. Samsung’s new offerings include a third-generation millimeter-wave RFIC (Radio Frequency Integrated Circuit) chip, a second-generation 5G modem SoC (system-on-a-chip), and a new Digital Front End-RFIC chip, which supports mmWave and sub-6 GHz spectrum bands.
Sources speculate that these new chipsets will power Samsung's future 5G Compact Macro, baseband units, and Massive MIMO radios which will be available in 2022.
The company’s new chipsets boast reduced size, increased output and better power savings. Its second-gen 5G modem SoC will allow upcoming baseband to have twice the capacity and almost half the power usage compared to its previous versions. It will also support beamforming for mmWave 5G and Massive MIMO radio units.
In a statement, Samsung said that for the mmWave RFIC, its advanced chip technology will lower antenna size by 50%, maximizing interior space.
Anshel Sag, Senior Analyst with Moor Insights & Strategy, mentioned that while Samsung's semiconductors have a key niche in the market, one feature that strikes out is that they're all made locally in South Korea. The new chipsets continue to reinforce Samsung's superiority in 5G infrastructure, whether it be in edge, radio, or the RFIC, said Sag.
In the U.S., Samsung has struck a $6 billion network deal with Verizon, as well as with Vodafone in Europe. It has also been successful in the markets of Japan, Canada, and New Zealand. As per reports, the chipmaker accounted for the fifth position in the worldwide RAN market in 2020, with a revenue share of between 5% and 10%.